Synthesis, microstructural characterization and properties of thin film materials for applications in high frequency bulk acoustic wave devices

Currently, two significant trends in the development of complex electronic systems are the miniaturization of components and the integration of multiple functional modules into single devices. The aim is to create more mobile and portable systems that are also cost-effective while incorporating various sensing or actuating functions. In this context, the advancement of dielectric, piezoelectric, pyroelectric, and ferroelectric materials in thin film form has gained considerable attention. Practical applications include miniaturized antenna duplexers, multiplexers for cellular base stations, and voltage-controlled oscillators. The rapid expansion of wireless communication networks has led to increased congestion in the Hertzian spectrum, highlighting the demand for greater bandwidth to facilitate accurate device-to-device transmission. The market for cellular and cordless phones is vast, with emerging markets for similar technologies like Bluetooth and wireless local area networks (WLAN), including navigation systems. These products depend on essential functional components such as high-frequency filters, amplifiers, mixers, and antennas. An ideal solution would be to integrate amplifiers and filters into a single package, thereby reducing the size, cost, and complexity of wireless phones.