The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

The book explores the challenges faced by package manufacturers in creating reliable, high-leadcount fine pitch thin packages that effectively dissipate heat. It emphasizes the importance of optimizing package structures, materials, and manufacturing processes while predicting potential failures to minimize costly trials. With 95% of ICs encapsulated in cost-effective plastic, the development of robust and lightweight packages has evolved significantly since the 1970s. The demand for advanced plastic packages, such as PQFPs and TQFPs, is projected to rise dramatically, highlighting the industry's growth potential.