The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

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The book addresses the complexities faced by package manufacturers in creating fine pitch thin packages with high lead counts that efficiently dissipate heat. It emphasizes the need for optimized structures, materials, and processes, alongside predictive measures to anticipate failures before production. With 95% of integrated circuits encapsulated in plastic for its cost-effectiveness and suitability for automated assembly, the evolution of packaging from basic DIP to advanced PQFPs and TQFPs is explored, highlighting a significant growth in demand projected for the near future.